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UFO Forum
other then ufo subjects
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<table border="0" cellpadding="3" cellspacing="1" width="100%" class="forumline"> <tr> <th class="thCornerL" width="22%" height="26">Author</th> <th class="thCornerR">Message</th> </tr> <tr> <td width="22%" align="left" valign="top" class="row1"><span class="name"><a name=""></a><b>adz213r5x</b></span></td> <td class="row1" height="28" valign="top"><table width="100%" border="0" cellspacing="0" cellpadding="0"> <tr> <td width="100%"><img src="http://picsrv.fora.pl/Boyz/images/icon_minipost.gif" width="12" height="9" alt="Post" title="Post" border="0" /><span class="postdetails">Posted: Mon 2:36, 18 Apr 2011<span class="gen"> </span> Post subject: BCD launched a series of LED driver solutions for</span></td> </tr> <tr> <td colspan="2"><hr /></td> </tr> <tr> <td colspan="2"><span class="postbody">led industry in particular is currently considering how to reduce costs and improve productivity, <a href="http://www.flashingboards.com/" target="_blank" class="postlink">led sign</a> and also meet the needs of environmental protection and industrial safety, etc., can be expectedto have the operating system standardization and process automation equipment, production lines will be the future mass production of led main competition. <br />another 350μm & time350μm p diagonal layout electrode wire electrode away from the diagonal electrode chip n vf relativelyhigh, <a href="http://www.flashingboards.com/" target="_blank" class="postlink">neon sign</a> indicating that p wire electrode and the current density below n equidistant electrode under the current expansion of the electrode density, increase the wire electrode and n p the distance between electrodes, the larger the chip the equivalent bulkresistance. <br />well-known, led is a semiconductor product, if the led pin of the two pins or more components between the medium voltage exceeds the breakdown strength, it will cause damage to the device. the thinner oxide layer, the <a href="http://www.flashingboards.com/" target="_blank" class="postlink">led message board</a> ic and the greater the sensitivity of static, such as solder is not full, the quality of the solder itself, problems, etc., will have a serious leak paths, resulting in devastating damage. another failure was due to the node temperature exceeds the melting point of semiconductor silicon (1415 ℃) arising from. pulse energy can generate static electricity localized heating, resulting in the breakdown of the lamp and the ic directly to the fault.</span></td> </tr> </table></td> </tr> <tr> <td colspan="2" height="1" class="spaceRow"><img src="http://picsrv.fora.pl/Boyz/images/spacer.gif" alt="" width="1" height="1" /></td> </tr> </table>
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